Technical lead - Cards & Payments (TSYS / Processor Carve-Out)

We are seeking an experienced Technical Lead to support a strategic processor carve-out / cards platform transformation within a leading fintech/payments environment. This role requires deep expertise in card processing platforms, particularly TSYS Prime, along with strong experience in migrations or large-scale transformation programs.Key ResponsibilitiesLead the technical workstream for processor carve-out / card platform separation initiatives.Drive end-to-end migration of card portfolios, including issuing, acquiring, and transaction processing.Work closely with business, vendors, and technology teams to ensure seamless transition of systems and data.Provide expertise on TSYS Prime platform, including configuration, integration, and optimization.Define and oversee system architecture, data mapping, and interface design during carve-out.Manage UAT, system validation, and post-migration stabilization.Identify and mitigate technical risks, ensuring compliance with regulatory and security standards.Collaborate with internal and external stakeholders including processors, partners, and vendors.RequirementsStrong experience working on TSYS Prime platform (mandatory).Proven experience in processor carve-out, card platform migration, or large-scale transformation projects.Deep understanding of card issuing, acquiring, and payment processing lifecycle.Strong knowledge of APIs, system integrations, and data migration frameworks.Ability to lead technical teams and manage cross-functional stakeholders.Experience in fintech, banks, or payment processors is essential.PreferredPrior experience in processor separation / carve-out programs.Exposure to regulatory and compliance frameworks in payments.Experience working in GCC or international markets.#J-18808-Ljbffr