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Senior Package Designer
Uandwe Technologies
Bengaluru, India₹20,000–₹50,000/mo≈ AED 880-2.2K/moToday
IndiaDesignerFull Time
Job Description
Job Description Location: Bangalore, India Qualifications & Experience: More than 10+ years of experience in the flip chip BGA package design. Experience working on the Large Formfactor, high layer count designs, Stack-up definition, Bump and ball map definition, Package outline drawings. Very g
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