I
Packaging Designer
Insemi Technology Services
Bengaluru, India₹20,000–₹50,000/mo≈ AED 880-2.2K/moToday
IndiaDesignerFull Time
Job Description
JD Experience in ASIC package substrate layout (wire bond / flip chip). Work on package routing, pinout optimization, placement, stack-up, reference plane, and power distribution. Hands-on with Cadence APD / SiP tools and PCB layout tools (Constraint Manager). Understanding of high-speed signal inte
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